7-2019-1315

Advancements in Metrology through Interferometry with Doubled Imaging Area (IDIA)

Metrology, the science of measurement, plays a crucial role in various fields, including manufacturing, healthcare, and materials science. Accurate and efficient imaging techniques are essential for characterizing materials and biological samples. Traditional interferometric methods often face limitations in field of view (FOV) and acquisition speed, hindering their application in dynamic and large-scale measurements. The recent development of Interferometry with Doubled Imaging Area (IDIA) presents a significant advancement in this domain, offering enhanced capabilities for metrology applications.

Unmet Need
Current interferometric imaging techniques are constrained by a narrow FOV, particularly when using low-coherence light sources. This limitation is especially problematic when imaging large samples or dynamic processes, such as the behavior of biological cells or the rapid changes during lithography. The inability to capture a broader area in a single acquisition can lead to incomplete data and increased measurement times, ultimately affecting the efficiency and accuracy of metrological assessments. There is a pressing need for a solution that can expand the FOV while maintaining high resolution and fast acquisition rates.

Our Technology
The IDIA technique addresses these challenges by optically multiplexing two off-axis orthogonal interferograms from different regions of the sample onto a single camera sensor. This innovative approach effectively doubles the FOV without the need for complex optical elements. By utilizing both low-coherence and high-coherence light sources, IDIA can be adapted for various imaging scenarios, including quantitative phase imaging of biological specimens and real-time monitoring of lithography processes. The technology not only enhances the FOV but also retains the quantitative phase and intensity information, enabling comprehensive analysis of samples.
The technique can profile in 3D flat (0.1 micron-1000 micron) and thin (1 nm – 100 micron) objects, even during fast dynamic processes. It can work in both transmission and reflection imaging modes. In fact, up to 6 parallel channels of complex wavefronts can be multiplexed on the same camera plane and captured in a single exposure without camera resolution loss. The multiplexed layers are not limited to different FOVs. It can multiplex different wavelength channels, different viewing angles, different axial planes, etc.

Market
The potential applications of IDIA span multiple sectors within metrology. In the biomedical field, it can be used for detailed imaging of cellular structures, aiding in research and diagnostics. In manufacturing, IDIA can enhance quality control processes by providing rapid and accurate measurements of lithographed elements, crucial for integrated circuit production. Additionally, the technology can be integrated into existing holographic and interferometric setups, making it a versatile solution for industries requiring precise measurements and imaging capabilities. As the demand for high-resolution imaging and fast acquisition continues to grow, IDIA positions itself as a transformative tool in the metrology landscape.
In summary, the IDIA technique represents a significant leap forward in interferometric imaging, addressing critical unmet needs in metrology. By expanding the FOV and improving acquisition rates, IDIA opens new avenues for research and industrial applications, ultimately enhancing measurement accuracy and efficiency.

Sign up for
our events

    Close
    Life Science
    Magazine

      Close
      Hi-Tech
      Magazine

        Close